Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization
Tsai, Ming-Hung, Wang, Chun-Wen, Lai, Chia-Han, Yeh, Jien-Wei, Gan, Jon-YiewТом:
92
Рік:
2008
Мова:
english
Журнал:
Applied Physics Letters
DOI:
10.1063/1.2841810
Файл:
PDF, 503 KB
english, 2008