Design of Microstrip-to-Microstrip Via Transition in Multilayered LTCC for Frequencies up to 67 GHz
Tsai, Chih-Chun, Cheng, Yung-Shou, Huang, Ting-Yi, Hsu, Yungping Alvin, Wu, Ruey-BeeiТом:
1
Мова:
english
Журнал:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2011.2104416
Date:
April, 2011
Файл:
PDF, 812 KB
english, 2011
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