SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Wednesday 1 October 1997)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III - Mechanical stress and electromigration in an aluminum meander structure
Yu, Xiaoying, Weide, Kirsten, Keshavarzi, Ali, Prasad, Sharad, Hartmann, Hans-DieterТом:
3216
Рік:
1997
Мова:
english
DOI:
10.1117/12.284698
Файл:
PDF, 180 KB
english, 1997