[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - 2N Wire for Ultra Fine Pitch Wire Bonding: Challenges & Solutions
Hwang, June Sub, Kumar, Balasubramanian Senthil, Moon, Jeong Tak, Uhm, Chul, Kim, Yu Na, Sivakumar, Mohandass, Song Keng Yew, JamesРік:
2008
Мова:
english
DOI:
10.1109/EPTC.2008.4763529
Файл:
PDF, 4.87 MB
english, 2008
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