[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Analysis of the EMI and SI effects on the flexible-PCBs for mobile application
Tae-Heon Lee,, Chang-Gyun Kim,, Jang-Hoon Lee,, Jae-Kyung Wee,Рік:
2008
Мова:
english
DOI:
10.1109/EDAPS.2008.4736008
Файл:
PDF, 953 KB
english, 2008