A fully MEMS-compatible process for 3D high aspect ratio micro coils obtained with an automatic wire bonder
Kratt, K, Badilita, V, Burger, T, Korvink, J G, Wallrabe, UТом:
20
Мова:
english
Журнал:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/20/1/015021
Date:
January, 2010
Файл:
PDF, 1.02 MB
english, 2010