[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages
Son, Ho-Young, Lee, Woong-Sun, Noh, Seung-Kwon, Suh, Min-Suk, Oh, Jae-Sung, Kim, Nam-SeogРік:
2013
Мова:
english
DOI:
10.1109/IITC.2013.6615583
Файл:
PDF, 888 KB
english, 2013