[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Underfill characterization for multi-layer 3D-SiP stacked chip package
Chew, Michelle, Wai, Eva, Chew Tham Heang,, Ho, David, Lim, Sharon, Ser Choong Chong,, Chai, TC, Rao, Vempati SrinivasРік:
2011
Мова:
english
DOI:
10.1109/eptc.2011.6184465
Файл:
PDF, 1.56 MB
english, 2011
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