[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Challenges and approaches of ultra-fine pitch Cu pillar assembly on organic substrate using wafer level underfill
Lim, Sharon Pei-Siang, Siow, Li Yan, Chai, Tai Chong, Rao, Vempati Srinivasa, Takeda, Kohei, Enami, Toshio, Koh, Chee Guan, Wang, XiangFeng, Sun, Hong Qi, Ando, TomoyukiРік:
2013
DOI:
10.1109/eptc.2013.6745778
Файл:
PDF, 653 KB
2013
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