[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps
Selvanayagam, Cheryl S., Lau, John H., Xiaowu Zhang,, Seah, S. K. W., Vaidyanathan, Kripesh, Chai, T. C.Рік:
2008
Мова:
english
DOI:
10.1109/ectc.2008.4550108
Файл:
PDF, 1.39 MB
english, 2008
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