[IEEE Proceedings of 2010 International Symposium on VLSI Technology, System and Application - Hsin Chu, Taiwan (2010.04.26-2010.04.28)] Proceedings of 2010 International Symposium on VLSI Technology, System and Application - Thermo-mechanical stress characterization of tungsten-fill through-silicon-via
Dao, Thuy, Triyoso, Dina H., Mora, Rode, Kropewnicki, Tom, Griesbach, Brian, Booker, Doug, Petras, Mike, Adams, VanceРік:
2010
Мова:
english
DOI:
10.1109/vtsa.2010.5488931
Файл:
PDF, 561 KB
english, 2010
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