[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Mechanical characterization of copper based metallizations with different via-bottom geometries
Ciptokusumo, Johar, Weide-Zaage, Kirsten, Aubel, OliverРік:
2010
Мова:
english
DOI:
10.1109/ipfa.2010.5532227
Файл:
PDF, 729 KB
english, 2010