[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC
Shenglin Ma,, Xin Sun,, Yunhui Zhu,, Qinghu Cui,, Yufeng Jin,, Xiaomei Yu,, Jing Chen,, Min Miao,Рік:
2011
Мова:
english
DOI:
10.1109/eptc.2011.6184394
Файл:
PDF, 2.53 MB
english, 2011
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