[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Low-cost TSH (through-silicon hole) interposers for 3D IC integration
Lau, John H., Lee, Ching-Kuan, Zhan, Chau-Jie, Wu, Sheng-Tsai, Chao, Yu-Lin, Dai, Ming-Ji, Tain, Ra-Min, Chien, Heng-Chieh, Chien, Chun-Hsien, Cheng, Ren-Shin, Huang, Yu-Wei, Lee, Yuan-Chang, Hsiao, ZРік:
2014
Мова:
english
DOI:
10.1109/ectc.2014.6897301
Файл:
PDF, 1.46 MB
english, 2014
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