[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Signal integrity and reliability of a new Multi-Stack Package using a Pressure Conductive Rubber
Kibum Kang,, Jindo Byun,, Jae-Won Jang,, Hai-Young Lee,, Jae-Hoon Choi,, Jae-Seon Hwang,, Dong-Chun Lee,Рік:
2008
Мова:
english
DOI:
10.1109/edaps.2008.4736038
Файл:
PDF, 2.28 MB
english, 2008
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