[IEEE 2012 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu (2012.04.23-2012.04.25)] Proceedings of Technical Program of 2012 VLSI Design, Automation and Test - 3D-IC BISR for stacked memories using cross-die spares
Chun-Chuan Chi,, Yung-Fa Chou,, Ding-Ming Kwai,, Yu-Ying Hsiao,, Cheng-Wen Wu,, Yu-Tsao Hsing,, Li-Ming Denq,, Tsung-Hsiang Lin,Рік:
2012
Мова:
english
DOI:
10.1109/vlsi-dat.2012.6212621
Файл:
PDF, 432 KB
english, 2012
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