[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - ELK delaminate improvement methodology on Cu pillar interconnect BOP structure
Chang, Nistec, Lan, Albert, Liao, Mark, Chen, EasonРік:
2014
Мова:
english
DOI:
10.1109/ectc.2014.6897271
Файл:
PDF, 1.28 MB
english, 2014