[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Process development and characterization of BCB-based redistribution layer (RDL) for silicon interposer application
Sun, Xin, Cui, Qinghu, Zhu, Yunhui, Ma, Shenglin, Chen, Jing, Miao, Min, Jin, YufengРік:
2012
Мова:
english
DOI:
10.1109/estc.2012.6542148
Файл:
PDF, 15.61 MB
english, 2012
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