[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene
Waeterloos, J.J., Shaffer, E.O., Stokich, T., Hetzner, J., Price, D., Booms, L., Donaton, R.A., Beyer, G., Coenegrachts, B., Caluwaerts, R., Struyf, H., Tokei, Z.S., Vervoort, I., Sijmus, B., Vos, I.,Рік:
2001
Мова:
english
DOI:
10.1109/iitc.2001.930017
Файл:
PDF, 279 KB
english, 2001
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