[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
Yu, Aibin, Lau, John H., Soon Wee Ho,, Kumar, Aditya, Hnin Wai Yin,, Jong Ming Ching,, Kripesh, Vaidyanathan, Pinjala, Damaruganath, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin,Рік:
2009
Мова:
english
DOI:
10.1109/ectc.2009.5074039
Файл:
PDF, 883 KB
english, 2009
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