[IEEE Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (14-16 Oct. 1996)] Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - High temperature deformation of high density interconnects and packages by moire interferometry/FEM hybrid method
Jiansen Zhu,, Daqing Zou,, Fulong Dai,, Sheng Liu,, Yi-Fan Guo,Рік:
1996
Мова:
english
DOI:
10.1109/iemt.1996.559686
Файл:
PDF, 777 KB
english, 1996