Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading
Basaran, Cemal, Wen, YujunТом:
29
Мова:
english
Журнал:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.885966
Date:
December, 2006
Файл:
PDF, 422 KB
english, 2006