[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Measurement of die stresses in microprocessor packaging due to thermal and power cycling
Roberts, Jordan, Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C., Jaeger, Richard C., Lall, PradeepРік:
2012
Мова:
english
DOI:
10.1109/ectc.2012.6248918
Файл:
PDF, 1.61 MB
english, 2012
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