Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization
Lannon, John, Hilton, Allan, Huffman, Alan, Butler, Marianne, Malta, Dean, Gregory, Chris, Temple, DorotaТом:
4
Мова:
english
Журнал:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2284580
Date:
January, 2014
Файл:
PDF, 1.23 MB
english, 2014
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