Flip-Chip Bonding of MEMS Scanner for Laser Display Using Electroplated AuSn Solder Bump
Chu, Kun-Mo, Choi, Won-Kyoung, Ko, Young-Chul, Lee, Jin-Ho, Park, Hyo-Hoon, Jeon, Duk YoungТом:
30
Мова:
english
Журнал:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.890209
Date:
February, 2007
Файл:
PDF, 2.28 MB
english, 2007