[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test
Tee, Tong Yan, Tan, Long Bin, Anderson, Rex, Ng, Hun Shen, Low, Jim Hee, Khoo, Choong Peng, Moody, Robert, Rogers, BoydРік:
2008
Мова:
english
DOI:
10.1109/eptc.2008.4763574
Файл:
PDF, 11.45 MB
english, 2008
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