[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Tin whisker growth on bright Sn films supported by lead-frame alloy substrates
Liu, Ting, Ding, Dongyan, Wang, Yiqing, Hu, Yu, Gong, Yihua, Galuschki, Klaus-PeterРік:
2012
Мова:
english
DOI:
10.1109/icept-hdp.2012.6474810
Файл:
PDF, 3.49 MB
english, 2012