Nonuniform temperature distribution in electronic devices cooled by flow in parallel microchannels
Hestroni, G., Mosyak, A., Segal, Z.Том:
24
Мова:
english
Журнал:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.910797
Date:
March, 2001
Файл:
PDF, 187 KB
english, 2001
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