[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Power Delivery Network Design for 3D SIP Integrated over Silicon Interposer Platform
Lee, Heeseok, Choi, Yun-Seok, Song, Eunseok, Choi, Kiwon, Cho, Taeje, Kang, SayounРік:
2007
Мова:
english
DOI:
10.1109/ectc.2007.373945
Файл:
PDF, 3.85 MB
english, 2007