[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - A Novel CoWP Cap Integration for Porous Low-WCu Interconnects With NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure
Kawahara, N., Tagami, M., Withers, B., Kakuhara, Y., Imura, H., Ohto, K., Taiji, T., Arita, K., Kurokawa, T., Nagase, M., Maruyama, T., Oda, N., Hayashi, Y., Jacobs, J., Sakurai, M., Sekine, M., Ueno,Рік:
2006
Мова:
english
DOI:
10.1109/iitc.2006.1648674
Файл:
PDF, 1.22 MB
english, 2006