[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Low cost silver alloy wire bonding with excellent reliability performance
Cheng, C. H, Hsiao, H. L, Chu, S. I, Shieh, Y. Y, Sun, C. Y, Peng, C.Рік:
2013
Мова:
english
DOI:
10.1109/ectc.2013.6575781
Файл:
PDF, 1.11 MB
english, 2013
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