[IEEE 2008 IEEE Custom Integrated Circuits Conference - CICC 2008 - San Jose, CA, USA (2008.09.21-2008.09.24)] 2008 IEEE Custom Integrated Circuits Conference - Stacking technology based on 8-inch wafers using direct connection between TSV and micro-bump
Miyakawa, Nobuaki, Hashimoto, Eiri, Maebashi, Takanori, Nakamura, Natsuo, Sacho, Yutaka, Nakayama, Shigeto, Toyoda, ShinjiroРік:
2008
Мова:
english
DOI:
10.1109/cicc.2008.4672169
Файл:
PDF, 1023 KB
english, 2008
File converter
Більше результатів пошуку
More benefits 
