[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Fabrication of fine wiring structure by electrodeposited polyimide for high density packaging and interconnection
Tokoro, K., Nakagawa, H., Kikuchi, K., Eun-Sil Jung,, Segawa, S., Itatani, H., Aoyagi, M.Рік:
2002
Мова:
english
DOI:
10.1109/eptc.2002.1185698
Файл:
PDF, 675 KB
english, 2002