[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Bottom-up filling of Through Silicon Via (TSV) with Parylene as sidewall protection layer
Miao, Min, Zhu, Yunhui, Ji, Ming, Ma, Shenglin, Sun, Xin, Jin, YufengРік:
2009
Мова:
english
DOI:
10.1109/eptc.2009.5416507
Файл:
PDF, 4.61 MB
english, 2009