Development of Inclined Conductive Bump for Flip-Chip Interconnection
Park, Ah-Young, Park, Seungbae, Yoo, Choong D.Том:
5
Мова:
english
Журнал:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2014.2379264
Date:
February, 2015
Файл:
PDF, 3.13 MB
english, 2015