Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content
Chuang, Tung-Han, Lin, Hsin-Jung, Wang, Hsi-Ching, Chuang, Chien-Hsun, Tsai, Chih-HsinТом:
44
Мова:
english
Журнал:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3558-7
Date:
February, 2015
Файл:
PDF, 1.87 MB
english, 2015