Interfacial reactions and diffusion path in gold–tin–nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging
Garnier, Arnaud, Baillin, Xavier, Hodaj, FiqiriТом:
26
Мова:
english
Журнал:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2852-3
Date:
June, 2015
Файл:
PDF, 2.88 MB
english, 2015
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