Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, JoergТом:
43
Мова:
english
Журнал:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3377-x
Date:
December, 2014
Файл:
PDF, 7.58 MB
english, 2014
File converter
Більше результатів пошуку
More benefits 
