Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP
Doy, Toshiroh K., Seshimo, Kiyoshi, Suzuki, Keisuke, Philipossian, Ara, Kinoshita, MasakiТом:
151
Рік:
2004
Мова:
english
Журнал:
Journal of The Electrochemical Society
DOI:
10.1149/1.1646144
Файл:
PDF, 141 KB
english, 2004