Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects
Gan, Z.H., Shao, W., Mhaisalkar, S.G., Chen, Z., Li, Hongyu, Tu, K.N., Gusak, A.M.Том:
21
Мова:
english
Журнал:
Journal of Materials Research
DOI:
10.1557/jmr.2006.0270
Date:
September, 2006
Файл:
PDF, 233 KB
english, 2006