Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications
Meschi Amoli, Behnam, Hu, Anming, Zhou, Norman Y., Zhao, BoxinТом:
26
Мова:
english
Журнал:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3016-1
Date:
July, 2015
Файл:
PDF, 3.12 MB
english, 2015