Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity
Koiwa, Kozo, Omiya, Masaki, Shishido, Nobuyuki, Kamiya, Shoji, Sato, Hisashi, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Suzuki, Toshiaki, Nokuo, TakeshiТом:
52
Мова:
english
Журнал:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.52.04CB05
Date:
April, 2013
Файл:
PDF, 597 KB
english, 2013