[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - Scenario for catastrophic failure in interconnect structures under chip package interaction
Omiya, Masaki, Kamiya, Shoji, Shishido, Nobuyuki, Koiwa, Kozo, Sato, Hisashi, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Suzuki, Toshiaki, Nokuo, TakeshiРік:
2015
Мова:
english
DOI:
10.1109/IRPS.2015.7112751
Файл:
PDF, 823 KB
english, 2015
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