Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging
Zhang, Liang, Sun, Lei, Han, Ji-guang, Guo, Yong-huanТом:
26
Мова:
english
Журнал:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3202-1
Date:
August, 2015
Файл:
PDF, 1.02 MB
english, 2015