Effect of current density on microstructure and mechanical property of Cu micro-cylinders electrodeposited in through silicon vias
Wang, Huiying, Cheng, Ping, Wang, Hong, Liu, Rui, Sun, Liming, Rao, Qunli, Wang, Zhaoyu, Gu, Ting, Ding, GuifuМова:
english
Журнал:
Materials Characterization
DOI:
10.1016/j.matchar.2015.09.029
Date:
October, 2015
Файл:
PDF, 1.46 MB
english, 2015
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