Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations
Yang, Nuo, Luo, Tengfei, Esfarjani, Keivan, Henry, Asegun, Tian, Zhiting, Shiomi, Junichiro, Chalopin, Yann, Li, Baowen, Chen, GangТом:
12
Мова:
english
Журнал:
Journal of Computational and Theoretical Nanoscience
DOI:
10.1166/jctn.2015.3710
Date:
February, 2015
Файл:
PDF, 3.51 MB
english, 2015