[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Sequentially stacked 3DIC technology using green nanosecond laser crystallization and laser spike annealing technologies
Chih-Chao Yang,, Tung-Ying Hsieh,, Wen-Hsien Huang,, Hsing-Hsiang Wang,, Chang-Hong Shen,, Jia-Min Shieh,Рік:
2015
Мова:
english
DOI:
10.1109/IPFA.2015.7224423
Файл:
PDF, 373 KB
english, 2015
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