[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Non-orthogonal 2.5D PEEC for power integrity analysis
Nayak, Bibhu Prasad, Vedicherla, Sreenivasulu Reddy, Gope, DipanjanРік:
2015
DOI:
10.1109/edaps.2015.7383695
Файл:
PDF, 819 KB
2015