Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data?
Suhir, Ephraim, Morris, James E., Wang, Liang, Yi, SungТом:
27
Мова:
english
Журнал:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-4617-z
Date:
July, 2016
Файл:
PDF, 473 KB
english, 2016
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