SPIE Proceedings [SPIE Micromachining and Microfabrication - San Francisco, CA (Monday 22 October 2001)] Reliability, Testing, and Characterization of MEMS/MOEMS - Packaging issues using FEA and experimental verification on a Si-based capacitive microrelay
Premachandran, C. S., Zhang, Xiaowu, Chai, T. C., Samper, Victor, Lim, T. B., Ramesham, RajeshuniТом:
4558
Рік:
2001
Мова:
english
DOI:
10.1117/12.443005
Файл:
PDF, 106 KB
english, 2001
File converter
Більше результатів пошуку
More benefits 
